LG Electronics has joined the NVIDIA Partner Network (NPN) as a Power and Cooling Solution Preferred Partner, strengthening its position in thermal management for high-density AI data centres.

The partnership, unveiled on 29 September, comes as AI-driven data centres demand greater cooling efficiency to manage rising thermal loads. LG said its liquid cooling portfolio is designed to be integrated during the early stages of facility planning, giving operators a clearer basis for designing cooling systems and supporting infrastructure for next-generation AI factories.

Largest cooling capacity among DSX Ready CDU partners

LG’s 2.6-megawatt (MW) Coolant Distribution Unit (CDU) has qualified as an NVIDIA DSX Ready CDU, which the company said gives it the largest cooling capacity among DSX Ready CDU partners to date. This follows the earlier infrastructure qualification of its 600-kilowatt and 1MW models, covering cooling performance, failover capabilities and reliability.

The units use a direct-to-chip (DTC) liquid cooling method that delivers coolant directly to the CPU, GPU and other heat-generating components, operating alongside existing air-cooling infrastructure to form a hybrid cooling system. LG’s NVIDIA-qualified CDUs will be showcased at Data Centre World Asia 2026, held from 29 to 30 September at Marina Bay Sands in Singapore.

4.0MW model qualification planned by year-end

By the end of 2026, LG plans to pursue NVIDIA qualification for its 4.0MW CDU model, expanding its portfolio of liquid cooling solutions for next-generation AI data centres.

“Joining the NVIDIA Partner Network as a Power and Cooling Preferred Partner is a pivotal step in our strategy to support the expansion of the global AI ecosystem,” said James Lee, president of the LG ES Company. “Together with NVIDIA, LG will help shape the future of AI data centres by delivering advanced cooling solutions that address the industry’s most critical thermal challenges.”