The Taiwan Artificial Intelligence Association (TAIA) and the Singapore AI Association have signed a memorandum of understanding (MoU) on AI cooperation. The signing took place at Tech Week Singapore 2026, held on 29 and 30 September at the Sands Expo and Convention Centre, where Taipei City and the Taiwan External Trade Development Council (TAITRA) ran a Taipei Pavilion.

The MoU sets a framework for AI advisory services, technical and market intelligence exchange, enterprise and trade exchanges, and SME expansion. The organisers said it will support future exchanges and help identify joint projects. No specific projects were named.

Taipei Pavilion at Tech Week Singapore

The pavilion, themed “Smart Tech, Innovative Taipei,” brought together 12 Taipei-based technology companies. Their products covered AI-ready data, edge computing, cybersecurity, industrial intelligence, multilingual communication and smart-city applications. Tech Week Singapore’s own theme this year was “The Infrastructure Era.”

• BigObject: AI-ready data infrastructure for governed enterprise data and AI agents.
• NETIO Technologies and Shuttle: industrial edge-computing platforms with local AI processing.
• SYSTEX: cybersecurity visibility, Shadow AI management and exposure management.
• Harbor Technology Solutions: AI equipment diagnostics based on vibration, acoustics and electromagnetic signals.
• IPEVO: real-time transcription and multilingual translation.

The other participants were Optiqb AI Technology, Qulip Technology, Galaxy Software Services, Eslitec, AR2VR and Ubitus.

Trade ties between Taiwan and Singapore

The organisers pointed to trade data to explain the push. Taiwan became Singapore’s largest goods trading partner in 2025, with bilateral trade reported at S$170.3 billion. Trade rose 94.1% in the first half of 2026 against the same period a year earlier.

Jules Shih, Manager at TAITRA, said Singapore offers “a trusted environment for enterprise deployment and a gateway to ASEAN,” while Taipei contributes strengths in AI infrastructure, semiconductors, hardware and edge computing.