LG Electronics is showcasing its “Chip-to-Chiller” cooling solutions for AI servers at Data Centre World Asia 2026, running Sept 29-30 at the Marina Bay Sands Expo and Convention Centre. The exhibition highlights the company’s approach to the thermal management and power needs of AI data centres.

Participating in the event for a second year, LG’s booth is more than three times the size of its 2025 presence. The company is presenting an integrated infrastructure offering under its “One LG” strategy, bringing together its heating, ventilation and air conditioning technology with LG CNS’s data centre design, build and operation expertise and LG Energy Solution’s power equipment. LG Energy Solution is showing battery solutions for AI data centres, including a Battery Energy Storage System, Battery Backup Unit and Uninterruptible Power Supply.

Prefabricated systems for faster deployment

LG’s prefabricated hydronic solutions combine cooling apparatus, power equipment and control systems into a single module, cutting down on-site engineering work and deployment time. Its air-cooled centrifugal chiller uses an oil-free magnetic bearing compressor to reduce mechanical friction losses, along with a refrigerant-free cooling mode that draws on low outdoor temperatures to cut compressor load and energy use.

Liquid cooling for high-density AI servers

The company’s Coolant Distribution Units supply and circulate coolant to cold plates that sit directly on CPUs and GPUs. LG’s 1-megawatt, 2.6-megawatt and 600-kilowatt CDUs completed NVIDIA infrastructure qualification this year, covering cooling performance, failover and reliability criteria, and the 2.6-megawatt unit also qualified as an NVIDIA DSX Ready CDU. LG is also demonstrating an immersion cooling system that submerges servers in non-conductive fluid, and a Fan Wall Unit that uses high-efficiency EC fans for air-cooled racks.

A new Data Centre Cooling Manager uses AI to predict cooling load and coordinate CDUs, fan wall units and chillers as one system. LG CNS is separately unveiling a Prefabricated Modular Data Centre built from standardised GPU, server, power and cooling modules assembled off-site.

“As AI data centres grow in scale and complexity, customers need integrated infrastructure that can be deployed quickly, operated reliably and scaled efficiently,” said James Lee, president of the LG ES Company. “By combining LG’s Chip-to-Chiller technologies, LG CNS’s DBO capabilities and LG Energy Solution’s power equipment, we aim to become a leading end-to-end AI factory infrastructure partner.”